Technical Seminar on” Future of Mechanical Design Softwares in Packaging and Product Development “

On behalf of Department of Mechanical Engineering organize a Technical Seminar on ” Future of Mechanical Design Softwares in Packaging and Product Development” on 13.03.2025.

Chief Guest:    Er. A. Dinesh Kumar, B. E ,

                      Packaging Research Associates,

                           HEPL Cavinkare, Chennai.